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MS-S1 MAX empowers AI enthusiasts to run large language models locally, build AI applications, and experience real-time, low-latency inference.
MS-S1 MAX enables geeks and power users to test cutting-edge AI frameworks, deploy multimodal models, and harness massive memory and computing power.
MS-S1 MAX is designed for creative professionals, accelerating video editing, 3D rendering, AI art, and audio production through 128GB UMA memory and multi-display output.
Compatible with diverse large models and precision levels, delivering fast and stable output.
Powered by AMD Ryzen™ AI Max+ 395, integrating Zen5 CPU, RDNA 3.5 GPU, and a next-gen NPU. With 16 cores and 32 threads delivering RTX 4070 Laptop-level GPU performance plus 50 TOPS NPU acceleration, it achieves more efficient AI inference.
Delivers up to 126 TOPS, with AI performance tested at 2.2× that of RTX 4090, effortlessly handling everything from LLMs to multimodal generation.
Supports up to 128GB LPDDR5x-8000MT/s quad-channel memory, eliminating traditional VRAM bottlenecks for low-latency, high-speed data transfer.
160W peak power, 130W sustained load, ensuring long-term high-intensity computing stability.
Two MS-S1 MAX units can be easily clustered together, flexibly scaling computing power for personal research or small studio workloads. In real-world tests, a dual-unit cluster runs the 235B Q4 large model locally, delivering an output speed of 10.87 tok/sec.
Supports 2U rack deployment, where multiple MS-S1 MAX units can be cascaded into a distributed cluster, creating an efficient AI computing hub for enterprises and research teams.
In real-world testing, a four-unit cluster successfully ran the DeepSeek-R1 671B Q4 large model (380GB, Q4_0 quantization), marking a breakthrough in local large-model computation for compact AI workstations.
Aluminum chassis integrates a diamond-matrix grill for robust durability and efficient airflow, achieving a perfect synergy of superior cooling and tech-inspired aesthetics.
The pure copper heat spreader instantly captures CPU heat, which is then efficiently distributed and dissipated by the six high-performance heat pipes for dramatically lower temperatures.
They generate a powerful, focused airflow to efficiently exhaust heat to prevent heat buildup.
It liquefies under heat to perfectly fill microscopic imperfections between the chip and cooler, resulting in superior thermal transfer compared to standard pastes.
With a robust 130W stable PPT and 160W Fast PPT, our cooling system confidently handles intense workloads, translating extreme power into unwavering performance, not thermal throttling.
Built-in 320W high-efficiency PSU with CCC, FCC, UL, CE, UKCA and more global certifications, ensuring stable and reliable power delivery.
Front
Rear
1.Power Button
2. DMIC ×2
3. USB 3.2 Gen2 (10Gbps)
4. USB4 ×2 (40Gbps, Alt DP2.0, PD out 15W)
5. 3.5mm Audio Combo Jack
6.HDMI™ 2.1 FRL (Up to 8K@60Hz/4K@120Hz)
7. USB 2.0 ×2
8. USB4 V2 ×2 (80Gbps, Alt DP2.0, PD out 15W)
9. USB 3.2 Gen2 (10Gbps)
10. 10GbE LAN x2 (RJ45, Realtek RTL8127)
11. Anti-Theft Lock Hole
12. Reset Hole (Clear CMOS)
13. AC INPUT
1.Power Button
2. DMIC ×2
3. USB 3.2 Gen2 (10Gbps)
4. USB4 ×2 (40Gbps, Alt DP2.0, PD out 15W)
5. 3.5mm Audio Combo Jack
6.HDMI™ 2.1 FRL (Up to 8K@60Hz/4K@120Hz)
7. USB 2.0 ×2
8. USB4 V2 ×2 (80Gbps, Alt DP2.0, PD out 15W)
9. USB 3.2 Gen2 (10Gbps)
10. 10GbE LAN x2 (RJ45, Realtek RTL8127)
11. Anti-Theft Lock Hole
12. Reset Hole (Clear CMOS)
13. AC INPUT
Storage & Expansion
Dual M.2 slots (PCIe 4.0 x4 + x1) support up to 8+8=16TB with RAID0/1, integrated slide-out board design enables effortless upgrades and maintenance.
Per Slot Maximum SSD Capacity
Flexible RAID Support
Storage & Expansion
Dual M.2 slots (PCIe 4.0 x4 + x1) support up to 8+8=16TB with RAID0/1, integrated slide-out board design enables effortless upgrades and maintenance.
Per Slot Maximum SSD Capacity
Flexible RAID Support
Flexible Customization
Full-length PCIe x16 slot supports industry-specific expansion needs.
Supports Full-length Cards
High-speed Expansion
Flexible Customization
Full-length PCIe x16 slot supports industry-specific expansion needs.
Supports Full-length Cards
High-speed Expansion
AMD Ryzen™ AI Max+ 395
16 Cores, 32 Threads
Max Clock: 5.1 GHz
Performance Mode: 130W
Balanced Mode: 95W
Quiet Mode: 60W
Radeon 8060S Graphics (Internal)
GPU Cores: 40
GPU Clock: 2900 MHz
AMD Ryzen™ AI
NPU Computing Power: Up to 50 TOPS
Total Computing Power: Up to 126 TOPS
LPDDR5x-256Bit
Max frequency support: 8000MHz
Max capacity support: 128GB
1× M.2 2280 NVMe SSD slot
(supports up to 8TB, PCIe 4.0 ×4)
1× M.2 2280 NVMe SSD slot
(supports up to 8TB, PCIe 4.0 ×1)
6 Heat Pipes & Phase Change Material
Dual Turbine Fans
Max CPU Fan Speed: 3600 RPM
Wi-Fi 7 | Bluetooth® 5.4
2× 10GbE LAN (RJ45)
1× HDMI (up to 8K@60Hz/4K@120Hz)
2× USB4 (up to 8K@60Hz/4K@120Hz)
2× USB4 V2 (up to 8K@60Hz/4K@120Hz)
HDMI ×1
3.5mm Audio Combo Jack (TRRS) ×1
DMIC ×2
3.5mm Audio Combo Jack (TRRS) ×1
2× USB4 (40Gbps, Alt DP 2.0, PD out 15W)
1× USB 3.2 Gen2 (10Gbps)
1× 3.5mm Audio Combo Jack (TRRS)
2× DMIC
1× 10GbE LAN (RJ45, Realtek RTL8127)
1× 10GbE LAN (RJ45, Realtek RTL8127)
2× USB 3.2 Gen2 (10Gbps)
2× USB 2.0
2× USB4 V2 (80Gbps, Alt DP2.0, PD out 15W)
1× HDMI 2.1 FRL (Up to 8K@60Hz/4K@120Hz)
PCIe ×16 slot (PCIe 4.0 ×4)
1× Power Button (with LED)
1× BIOS Reset Hole
Windows 11 Pro
Windows 11 24H2 Pro / Home
AC INPUT
(100-240V ~6A 50-60Hz, Internel-DC 12V/26.6A, 320W MAX)
100-178.5mm
222.1 × 206.3 × 77.1 mm
2.8 kg